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1 Ergebnisse
1
Silicon Optical Electrical Interposer - Fiber to the Chip:
, In:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
,
Guan, Lim Teck
;
Yu, Li Hong
;
Chinq, Jong Ming
... - p. 34-39 , 2019
Link:
https://doi.org/10.1109/EPTC47984.2019.9026602
RT T1 <cTitle>2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Silicon Optical Electrical Interposer - Fiber to the Chip</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9026602&Exemplar=1&LAN=DE A1 Guan, Lim Teck A1 Yu, Li Hong A1 Chinq, Jong Ming A1 Ching, Eva Wai Leong A1 Choong, Chong Ser A1 Thor, Lim Soon A1 Ang, Thomas Y. L A1 Rong, Ong Jun YR 2019 K1 Optical fiber couplers K1 Silicon K1 Integrated optics K1 High-speed optical techniques K1 Optical switches K1 Flip-chip devices K1 Silicon photonics K1 Si Interposer K1 Optoelectronic integration SP 34 OP 39 LK http://dx.doi.org/https://doi.org/10.1109/EPTC47984.2019.9026602 DO https://doi.org/10.1109/EPTC47984.2019.9026602 SF ELIB - SuUB Bremen
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