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Ultra High Density Package Design and Electrical Analysis i..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hsieh, Tsun-Lung ; Kuo, Hung-Chun ; Jhong, Ming-Fong.. - p. 457-460 , 2019
Link: https://doi.org/10.1109/EPTC47984.2019.9026605