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1 Ergebnisse
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The challenges of warpage with thin core substrate for 2.5D..:
, In:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
,
Huang, Huei Nuan
;
Hung, Joseph
;
Tsai, Yu Huci
... - p. 684-687 , 2019
Link:
https://doi.org/10.1109/EPTC47984.2019.9026612
RT T1 <cTitle>2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>The challenges of warpage with thin core substrate for 2.5DIC assembly</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9026612&Exemplar=1&LAN=DE A1 Huang, Huei Nuan A1 Hung, Joseph A1 Tsai, Yu Huci A1 Ruan, Bo Yuan A1 Shi, Simon A1 Xie, Kunlushie A1 Liu, Chung Liang A1 Huang, Ting Kai A1 Zhuang, Hs A1 Huang, Austin A1 Chen, Jimmy YR 2019 K1 Substrates K1 Heat sinks K1 Bridges K1 Stacking K1 Reliability K1 Electronics packaging K1 Legged locomotion SP 684 OP 687 LK http://dx.doi.org/https://doi.org/10.1109/EPTC47984.2019.9026612 DO https://doi.org/10.1109/EPTC47984.2019.9026612 SF ELIB - SuUB Bremen
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