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Multiphysic Simulations for MEMS Sensor Package:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Del Sarto, M. ; Duca, R. ; Maierna, A.... - p. 688-695 , 2019
Link: https://doi.org/10.1109/EPTC47984.2019.9026616