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1 Ergebnisse
1
Application of Piezoresistive Stress Sensor in Mold-1st Fan..:
, In:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
,
Bu, Lin
;
Jong, Ming Chinq
;
Lau, Boon Long
... - p. 28-33 , 2019
Link:
https://doi.org/10.1109/EPTC47984.2019.9026633
RT T1 <cTitle>2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Application of Piezoresistive Stress Sensor in Mold-1st Fan-out Wafer Level Packaging Processes</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9026633&Exemplar=1&LAN=DE A1 Bu, Lin A1 Jong, Ming Chinq A1 Lau, Boon Long A1 Chua, Calvin Hung Ming A1 Lim, Sharon Pei Siang A1 Lim, Simon Siak Boon A1 Zhang, Xiaowu YR 2019 K1 Stress K1 Stress measurement K1 Piezoresistance K1 Semiconductor device reliability K1 Semiconductor device modeling K1 Reliability engineering SP 28 OP 33 LK http://dx.doi.org/https://doi.org/10.1109/EPTC47984.2019.9026633 DO https://doi.org/10.1109/EPTC47984.2019.9026633 SF ELIB - SuUB Bremen
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