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1 Ergebnisse
1
Carbon Nanotube for Interconnects and Nano-Packaging Applic..:
, In:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
,
Siah, Chun Fei
;
Wang, Jianxiong
;
Roux-Levy, Philippe
... - p. 574-577 , 2019
Link:
https://doi.org/10.1109/EPTC47984.2019.9026662
RT T1
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
: T1
Carbon Nanotube for Interconnects and Nano-Packaging Application
UL https://suche.suub.uni-bremen.de/peid=ieee-9026662&Exemplar=1&LAN=DE A1 Siah, Chun Fei A1 Wang, Jianxiong A1 Roux-Levy, Philippe A1 Coquet, Philippe A1 Tay, Beng Kang A1 Baillargeat, Dominique YR 2019 K1 Through-silicon vias K1 Flip-chip devices K1 Integrated circuit interconnections K1 Carbon nanotubes K1 Substrates K1 Fabrication SP 574 OP 577 LK http://dx.doi.org/https://doi.org/10.1109/EPTC47984.2019.9026662 DO https://doi.org/10.1109/EPTC47984.2019.9026662 SF ELIB - SuUB Bremen
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