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1 Ergebnisse
1
Die Attachment on Bare Copper Surface by Non-Pressure Silve..:
, In:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
,
Chew, Ly May
;
Stegmann, Tamira
;
Schwenk, Erika
. - p. 289-293 , 2019
Link:
https://doi.org/10.1109/EPTC47984.2019.9026669
RT T1 <cTitle>2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Die Attachment on Bare Copper Surface by Non-Pressure Silver Sintering in Inert Atmosphere</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9026669&Exemplar=1&LAN=DE A1 Chew, Ly May A1 Stegmann, Tamira A1 Schwenk, Erika A1 Schmitt, Wolfgang YR 2019 K1 Silver K1 Lead K1 Bonding K1 Substrates K1 Refrigerators K1 Atmosphere K1 Surface treatment SP 289 OP 293 LK http://dx.doi.org/https://doi.org/10.1109/EPTC47984.2019.9026669 DO https://doi.org/10.1109/EPTC47984.2019.9026669 SF ELIB - SuUB Bremen
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