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1 Ergebnisse
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Comprehensive Study of Tin-Silver-Copper Lead-Free Alloys o..:
, In:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
,
Jaafar, Norhanani Binte
;
Choong, Chong Ser
- p. 658-662 , 2019
Link:
https://doi.org/10.1109/EPTC47984.2019.9026678
RT T1 <cTitle>2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Comprehensive Study of Tin-Silver-Copper Lead-Free Alloys on Various Bond Pad Metallisation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9026678&Exemplar=1&LAN=DE A1 Jaafar, Norhanani Binte A1 Choong, Chong Ser YR 2019 K1 Gold K1 Surface treatment K1 Aging K1 Shearing K1 Packaging K1 Lasers SP 658 OP 662 LK http://dx.doi.org/https://doi.org/10.1109/EPTC47984.2019.9026678 DO https://doi.org/10.1109/EPTC47984.2019.9026678 SF ELIB - SuUB Bremen
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