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1 Ergebnisse
1
Thermal simulation and measurement of SiC MOSETs:
, In:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
,
Kim, Jung Kyun
- p. 331-335 , 2019
Link:
https://doi.org/10.1109/EPTC47984.2019.9026682
RT T1 <cTitle>2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Thermal simulation and measurement of SiC MOSETs</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9026682&Exemplar=1&LAN=DE A1 Kim, Jung Kyun YR 2019 K1 Temperature measurement K1 Silicon carbide K1 Calibration K1 Thermal resistance K1 Semiconductor device measurement K1 Electrical resistance measurement K1 Transient analysis K1 thermal transient measurement K1 thermal characterization K1 power electronics K1 SiC MOSFET K1 Structure function K1 TDIM K1 calibration SP 331 OP 335 LK http://dx.doi.org/https://doi.org/10.1109/EPTC47984.2019.9026682 DO https://doi.org/10.1109/EPTC47984.2019.9026682 SF ELIB - SuUB Bremen
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