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Investigation on Thermal Contact Resistance Between Indium ..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hu, Jianxiong ; Fengchen, Zefang ; Zhang, Ye.. - p. 702-705 , 2019
Link: https://doi.org/10.1109/EPTC47984.2019.9026694