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Reliability Study of Low Cost TSV-Free Interposer (TFI):
, In:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
,
Li, H. Y.
;
Kawano, M.
;
Lim, P. S.
.. - p. 258-262 , 2019
Link:
https://doi.org/10.1109/EPTC47984.2019.9026704
RT T1 <cTitle>2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)</cTitle>: T1 <Title>Reliability Study of Low Cost TSV-Free Interposer (TFI)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9026704&Exemplar=1&LAN=DE A1 Li, H. Y. A1 Kawano, M. A1 Lim, P. S. A1 Che, F. X. A1 Chua, H. M. YR 2019 K1 Substrates K1 Reliability K1 Silicon K1 Inspection K1 Metals K1 Soldering K1 Compounds SP 258 OP 262 LK http://dx.doi.org/https://doi.org/10.1109/EPTC47984.2019.9026704 DO https://doi.org/10.1109/EPTC47984.2019.9026704 SF ELIB - SuUB Bremen
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