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Creep Damage of BGA Solder Interconnects Subjected to Therm..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Depiver, Joshua A. ; Mallik, Sabuj ; Harmanto, Dani. - p. 143-153 , 2019
Link: https://doi.org/10.1109/EPTC47984.2019.9026710