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Effects of in-plane property variations on warpage shapes o..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Kohara, Sayuri ; Okamoto, Keishi ; Mori, Hiroyuki - p. 485-490 , 2019
Link: https://doi.org/10.1109/EPTC47984.2019.9026717