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Development of 2.5D high density device on large ultra-thin..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Lim, Sharon Pei Siang ; Chidambaram, Vivek ; Jaafar, Norhanani. - p. 247-252 , 2019
Link: https://doi.org/10.1109/EPTC47984.2019.9026720