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1 Ergebnisse
1
Si-Embedded IC Package for W-band Applications: Interconnec..:
, In:
2019 IEEE Asia-Pacific Microwave Conference (APMC)
,
Lee, Hyun-Beom
;
Min, Byung-Wook
;
Kim, Young-Gon
... - p. 1080-1082 , 2019
Link:
https://doi.org/10.1109/APMC46564.2019.9038484
RT T1
2019 IEEE Asia-Pacific Microwave Conference (APMC)
: T1
Si-Embedded IC Package for W-band Applications: Interconnection Analysis
UL https://suche.suub.uni-bremen.de/peid=ieee-9038484&Exemplar=1&LAN=DE A1 Lee, Hyun-Beom A1 Min, Byung-Wook A1 Kim, Young-Gon A1 Yook, Jong Min A1 Kim, Sosu A1 Kim, Wansik YR 2019 K1 Loss measurement K1 Semiconductor device measurement K1 Microwave FET integrated circuits K1 Microwave integrated circuits K1 Microwave theory and techniques K1 Integrated circuit interconnections K1 embedded IC package K1 Si - interposer K1 chip embedding K1 w-band K1 interconnection SP 1080 OP 1082 LK http://dx.doi.org/https://doi.org/10.1109/APMC46564.2019.9038484 DO https://doi.org/10.1109/APMC46564.2019.9038484 SF ELIB - SuUB Bremen
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