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Full-wave RF Modeling of a Fan-Out Wafer-Level Packaging Te..:

, In: 2020 IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF),
Stocchi, M. ; Wietstruck, M. ; Schulze, S.... - p. 60-62 , 2020
Link: https://doi.org/10.1109/SIRF46766.2020.9040180