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Chemical-mechanical polishing (CMP) process of STI and DTI-..:
, In:
2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)
,
Lee, Shih-Ping
;
Tseng, Tzu-Hsuan
;
Chuang, Chih-Hao
... - p. 1-4 , 2019
Link:
https://doi.org/10.23919/eMDC/ISSM48219.2019.9052083
RT T1 <cTitle>2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)</cTitle>: T1 <Title>Chemical-mechanical polishing (CMP) process of STI and DTI- Ching-Yu Hsieh</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9052083&Exemplar=1&LAN=DE A1 Lee, Shih-Ping A1 Tseng, Tzu-Hsuan A1 Chuang, Chih-Hao A1 Chuang, Chien-Ying A1 Cheng, Cheng-Hung A1 Tung, Hsin-Ying A1 Huang, Pin-Chieh A1 Chou, Chung-Tien YR 2019 K1 Shallow trench isolation K1 Deep trench isolation K1 Chemical-mechanical polishing SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.23919/eMDC/ISSM48219.2019.9052083 DO https://doi.org/10.23919/eMDC/ISSM48219.2019.9052083 SF ELIB - SuUB Bremen
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