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1 Ergebnisse
1
Mining Factors Impact Wafer Circuit Probing Via Neural Netw..:
, In:
2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)
,
Kung, Ji Fu
;
Kung, Yung Chien
;
Lin, Jing Pei
... - p. 1-2 , 2019
Link:
https://doi.org/10.23919/eMDC/ISSM48219.2019.9052131
RT T1 <cTitle>2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM)</cTitle>: T1 <Title>Mining Factors Impact Wafer Circuit Probing Via Neural Network and Statistics for Semiconductor Device Fabrication</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9052131&Exemplar=1&LAN=DE A1 Kung, Ji Fu A1 Kung, Yung Chien A1 Lin, Jing Pei A1 Chen, Ming Wei A1 Chen, Te Hsuan A1 Yang, Hsiao Ying A1 Chen, Pei Wen YR 2019 K1 Neural networks K1 Correlation K1 Decision trees K1 Testing K1 Semiconductor device measurement K1 Semiconductor device modeling K1 Data mining K1 Yield Mining K1 Wafer Circuit Probing K1 Neural Network K1 Decision Tree K1 Regression Analysis SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/eMDC/ISSM48219.2019.9052131 DO https://doi.org/10.23919/eMDC/ISSM48219.2019.9052131 SF ELIB - SuUB Bremen
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