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Characterization of Nitride Passivated Cu Surface for Low-T..:
, In:
2019 International 3D Systems Integration Conference (3DIC)
,
Park, Hae-Sung
;
Seo, Han Kyeol
;
Kim, Sarah Eunkyung
- p. 1-4 , 2019
Link:
https://doi.org/10.1109/3DIC48104.2019.9058774
RT T1
2019 International 3D Systems Integration Conference (3DIC)
: T1
Characterization of Nitride Passivated Cu Surface for Low-Temperature Cu-Cu Bonding
UL https://suche.suub.uni-bremen.de/peid=ieee-9058774&Exemplar=1&LAN=DE A1 Park, Hae-Sung A1 Seo, Han Kyeol A1 Kim, Sarah Eunkyung YR 2019 K1 Surface treatment K1 Plasmas K1 Bonding K1 Response surface methodology K1 Rough surfaces K1 Surface roughness K1 Copper K1 Cu-Cu bonding K1 Low-temperature bonding K1 Nitride passivation K1 Ar-N2 plasma treatment K1 Response Surface Methodology (RSM) SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/3DIC48104.2019.9058774 DO https://doi.org/10.1109/3DIC48104.2019.9058774 SF ELIB - SuUB Bremen
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