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1 Ergebnisse
1
Design Considerations and Fabrication Challenges of Surface..:
, In:
2019 International 3D Systems Integration Conference (3DIC)
,
Tao, Jing
;
Li, Hong Yu
;
Zhao, Peng
... - p. 1-5 , 2019
Link:
https://doi.org/10.1109/3DIC48104.2019.9058780
RT T1 <cTitle>2019 International 3D Systems Integration Conference (3DIC)</cTitle>: T1 <Title>Design Considerations and Fabrication Challenges of Surface Electrode Ion Trap with TSV Integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9058780&Exemplar=1&LAN=DE A1 Tao, Jing A1 Li, Hong Yu A1 Zhao, Peng A1 Lim, Yu Dian A1 Apriyana, Anak Agung Alit A1 Tan, Chuan Seng YR 2019 K1 Through-silicon vias K1 Electrodes K1 Ions K1 Radio frequency K1 Silicon K1 Fabrication K1 Geometry K1 surface electrode ion trap K1 TSV K1 full-wafer fabrication K1 S-parameter analysis SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/3DIC48104.2019.9058780 DO https://doi.org/10.1109/3DIC48104.2019.9058780 SF ELIB - SuUB Bremen
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