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1 Ergebnisse
1
Vertical Stack Thermal Characterization of Heterogeneous In..:
, In:
2019 International 3D Systems Integration Conference (3DIC)
,
Harris, T. Robert
;
Davis, W. Rhett
;
Lipa, Steven
.. - p. 1-3 , 2019
Link:
https://doi.org/10.1109/3DIC48104.2019.9058784
RT T1
2019 International 3D Systems Integration Conference (3DIC)
: T1
Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages
UL https://suche.suub.uni-bremen.de/peid=ieee-9058784&Exemplar=1&LAN=DE A1 Harris, T. Robert A1 Davis, W. Rhett A1 Lipa, Steven A1 Pitts, W. Shepherd A1 Franzon, Paul D. YR 2019 K1 Electronic packaging thermal management K1 Gallium nitride K1 Temperature measurement K1 Semiconductor device measurement K1 Heating systems K1 Integrated circuits K1 Tools K1 2.5-D K1 heterogeneous integration K1 DAHI K1 thermal K1 heat HEMT K1 GaN K1 CMOS K1 measurement K1 3D SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/3DIC48104.2019.9058784 DO https://doi.org/10.1109/3DIC48104.2019.9058784 SF ELIB - SuUB Bremen
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