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1 Ergebnisse
1
Triple-Layering Technology for Pixel-Parallel CMOS Image Se..:
, In:
2019 International 3D Systems Integration Conference (3DIC)
,
Goto, Masahide
;
De Vos, Joeri
;
Watabe, Toshihisa
... - p. 1-4 , 2019
Link:
https://doi.org/10.1109/3DIC48104.2019.9058785
RT T1 <cTitle>2019 International 3D Systems Integration Conference (3DIC)</cTitle>: T1 <Title>Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9058785&Exemplar=1&LAN=DE A1 Goto, Masahide A1 De Vos, Joeri A1 Watabe, Toshihisa A1 Hagiwara, Kei A1 Nanba, Masakazu A1 Iguchi, Yoshinori A1 Higurashi, Eiji A1 Honda, Yuki A1 Saraya, Takuya A1 Kobayashi, Masaharu A1 Toshiyoshi, Hiroshi A1 Hiramotoi, Toshiro YR 2019 K1 Sensors K1 Gold K1 Three-dimensional displays K1 CMOS image sensors K1 Bonding K1 Silicon-on-insulator K1 image sensors K1 three-dimensional integration K1 silicon-on-insulator (SOI) K1 analog-to-digital converters SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/3DIC48104.2019.9058785 DO https://doi.org/10.1109/3DIC48104.2019.9058785 SF ELIB - SuUB Bremen
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