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Effects of Argon and Nitrogen ion Bombardments on Sputtered..:
, In:
2019 International 3D Systems Integration Conference (3DIC)
,
Seo, Han Kyeol
;
Park, Hae-Sung
;
Kim, Sarah Eunkyung
- p. 1-4 , 2019
Link:
https://doi.org/10.1109/3DIC48104.2019.9058789
RT T1
2019 International 3D Systems Integration Conference (3DIC)
: T1
Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application
UL https://suche.suub.uni-bremen.de/peid=ieee-9058789&Exemplar=1&LAN=DE A1 Seo, Han Kyeol A1 Park, Hae-Sung A1 Kim, Sarah Eunkyung YR 2019 K1 Surface treatment K1 Bonding K1 Surface morphology K1 Copper K1 Rough surfaces K1 Surface roughness K1 Plasmas K1 3D integration K1 low temperature Cu bonding K1 plasma activation K1 copper nitride SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/3DIC48104.2019.9058789 DO https://doi.org/10.1109/3DIC48104.2019.9058789 SF ELIB - SuUB Bremen
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