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1 Ergebnisse
1
A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image S..:
, In:
2019 International 3D Systems Integration Conference (3DIC)
,
Miura, Tsukasa
;
Sakakibara, Masaki
;
Takahashi, Hirotsugu
... - p. 1-2 , 2019
Link:
https://doi.org/10.1109/3DIC48104.2019.9058832
RT T1
2019 International 3D Systems Integration Conference (3DIC)
: T1
A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections
UL https://suche.suub.uni-bremen.de/peid=ieee-9058832&Exemplar=1&LAN=DE A1 Miura, Tsukasa A1 Sakakibara, Masaki A1 Takahashi, Hirotsugu A1 Taura, Tadayuki A1 Tatani, Keiji A1 Oike, Yusuke A1 Ezaki, Takayuki YR 2019 K1 Three-dimensional displays K1 CMOS image sensors K1 Bonding K1 Analog-digital conversion K1 Micromechanical devices K1 System integration K1 imagers K1 global shutter K1 analog-to-digital conversion K1 subthreshold current K1 stacking K1 back illumination K1 Cu-Cu connection K1 in-pixel analog-to-digital conversion K1 bonding K1 3D stacked K1 ADC SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/3DIC48104.2019.9058832 DO https://doi.org/10.1109/3DIC48104.2019.9058832 SF ELIB - SuUB Bremen
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