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1 Ergebnisse
1
Protective Layer for Collective Die to Wafer Hybrid Bonding:
, In:
2019 International 3D Systems Integration Conference (3DIC)
,
Inoue, Fumihiro
;
Bertheau, Julien
;
Suhard, Samuel
... - p. 1-4 , 2019
Link:
https://doi.org/10.1109/3DIC48104.2019.9058870
RT T1 <cTitle>2019 International 3D Systems Integration Conference (3DIC)</cTitle>: T1 <Title>Protective Layer for Collective Die to Wafer Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9058870&Exemplar=1&LAN=DE A1 Inoue, Fumihiro A1 Bertheau, Julien A1 Suhard, Samuel A1 Phommahaxay, Alain A1 Ohashi, Takuya A1 Kinoshita, Tetsuro A1 Kinoshita, Yohei A1 Beyne, Eric YR 2019 K1 Bonding K1 Blades K1 Surface treatment K1 Wafer bonding K1 Three-dimensional displays K1 Stacking K1 Coatings K1 Collective Die to Wafer direct bonding K1 Dicing K1 Protective layer SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/3DIC48104.2019.9058870 DO https://doi.org/10.1109/3DIC48104.2019.9058870 SF ELIB - SuUB Bremen
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