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1 Ergebnisse
1
Process Complexity and Cost Considerations of Multi-Layer D..:
, In:
2019 International 3D Systems Integration Conference (3DIC)
,
Velenis, Dimitrios
;
De Vos, Joeri
;
Kim, Soon-Wook
... - p. 1-6 , 2019
Link:
https://doi.org/10.1109/3DIC48104.2019.9058876
RT T1 <cTitle>2019 International 3D Systems Integration Conference (3DIC)</cTitle>: T1 <Title>Process Complexity and Cost Considerations of Multi-Layer Die Stacks</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9058876&Exemplar=1&LAN=DE A1 Velenis, Dimitrios A1 De Vos, Joeri A1 Kim, Soon-Wook A1 Derakhshandeh, Jaber J. A1 Bex, Pieter A1 Capuz, Giovanni A1 Suhard, Samuel A1 Rebibis, Kenneth June A1 Van Huylenbroeck, Stefaan A1 Jan Marinissen, Erik A1 Phommahaxay, Alain A1 Miller, Andy A1 Beyer, Gerald A1 Van der Plas, Geert A1 Beyne, Eric YR 2019 K1 Stacking K1 Bonding K1 Three-dimensional displays K1 Through-silicon vias K1 Testing K1 Compounds K1 System integration K1 W2W stacking K1 D2W stacking K1 hybrid bonding K1 hole-in-one K1 microbump K1 thermocompression bonding K1 3D integration K1 cost of ownership SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/3DIC48104.2019.9058876 DO https://doi.org/10.1109/3DIC48104.2019.9058876 SF ELIB - SuUB Bremen
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