I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Development of Laser-Assisted Bonding with Compression (LAB..:
, In:
2019 International 3D Systems Integration Conference (3DIC)
,
Choi, Kwang-Seong
;
Eom, Yong-Sung
;
Moon, Seok Hwan
... - p. 1-3 , 2019
Link:
https://doi.org/10.1109/3DIC48104.2019.9058890
RT T1
2019 International 3D Systems Integration Conference (3DIC)
: T1
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration
UL https://suche.suub.uni-bremen.de/peid=ieee-9058890&Exemplar=1&LAN=DE A1 Choi, Kwang-Seong A1 Eom, Yong-Sung A1 Moon, Seok Hwan A1 Joo, Jiho A1 Lee, Kwangjoo A1 Kim, Jung Hak A1 Kim, Ju hyeon YR 2019 K1 Bonding K1 Temperature measurement K1 Measurement by laser beam K1 Radiation effects K1 Power lasers K1 Semiconductor device measurement K1 laser-assisted bonding with compression (LABC) K1 non-conductive film (NCF) K1 bonding performance K1 throughput K1 thermal compression bonding (TCB) SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/3DIC48104.2019.9058890 DO https://doi.org/10.1109/3DIC48104.2019.9058890 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)