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A Built-in Self-Test Scheme for TSVs of Logic-DRAM Stacked ..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Yang, Wei-Hsuan ; Li, Jin-Fu ; Hsu, Chun-Lung.. - p. 1-3 , 2019
Link: https://doi.org/10.1109/3DIC48104.2019.9058898