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1 Ergebnisse
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Die to Wafer Direct Hybid Bonding Demonstration with High A..:
, In:
2019 International 3D Systems Integration Conference (3DIC)
,
Jouve, A.
;
Sanchez, L.
;
Castan, C.
... - p. 1-7 , 2019
Link:
https://doi.org/10.1109/3DIC48104.2019.9058905
RT T1
2019 International 3D Systems Integration Conference (3DIC)
: T1
Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields
UL https://suche.suub.uni-bremen.de/peid=ieee-9058905&Exemplar=1&LAN=DE A1 Jouve, A. A1 Sanchez, L. A1 Castan, C. A1 Bresson, N. A1 Fournel, F. A1 Raynaud, N. A1 Metzger, P. YR 2019 K1 Bonding K1 Stacking K1 Surface treatment K1 Copper K1 Surface topography K1 Cleaning K1 Pollution measurement K1 Internet of Things K1 Intrusion Detection K1 Online Machine Learning K1 Concept Drift K1 Anomaly Detection SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/3DIC48104.2019.9058905 DO https://doi.org/10.1109/3DIC48104.2019.9058905 SF ELIB - SuUB Bremen
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