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1 Ergebnisse
1
5.6 A 1/2.65in 44Mpixel CMOS Image Sensor with 0.7µm Pixels..:
, In:
2020 IEEE International Solid- State Circuits Conference - (ISSCC)
,
Kim, HyunChul
;
Park, Jongeun
;
Joe, Insung
... - p. 104-106 , 2020
Link:
https://doi.org/10.1109/ISSCC19947.2020.9062924
RT T1 <cTitle>2020 IEEE International Solid- State Circuits Conference - (ISSCC)</cTitle>: T1 <Title>5.6 A 1/2.65in 44Mpixel CMOS Image Sensor with 0.7µm Pixels Fabricated in Advanced Full-Depth Deep-Trench Isolation Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9062924&Exemplar=1&LAN=DE A1 Kim, HyunChul A1 Park, Jongeun A1 Joe, Insung A1 Kwon, Doowon A1 Kim, Joo Hyoung A1 Cho, Dongsuk A1 Lee, Taehun A1 Lee, Changkyu A1 Park, Haeyong A1 Hong, Soojin A1 Chang, Chongkwang A1 Kim, Jingyun A1 Lim, Hanjin A1 Oh, Youngsun A1 Kim, Yitae A1 Nah, Seungjoo A1 Jung, Sangill A1 Lee, Jaekyu A1 Ahn, JungChak A1 Hong, Hyeongsun A1 Lee, Kyupil A1 Kang, Ho-Kyu YR 2020 SN 2376-8606 K1 Diffusion tensor imaging K1 CMOS image sensors K1 Photodiodes K1 Dark current K1 Silicon K1 Cameras SP 104 OP 106 LK http://dx.doi.org/https://doi.org/10.1109/ISSCC19947.2020.9062924 DO https://doi.org/10.1109/ISSCC19947.2020.9062924 SF ELIB - SuUB Bremen
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