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1 Ergebnisse
1
8.1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 2..:
, In:
2020 IEEE International Solid- State Circuits Conference - (ISSCC)
,
Gomes, Wilfred
;
Khushu, Sanjeev
;
Ingerly, Doug B.
... - p. 144-146 , 2020
Link:
https://doi.org/10.1109/ISSCC19947.2020.9062957
RT T1 <cTitle>2020 IEEE International Solid- State Circuits Conference - (ISSCC)</cTitle>: T1 <Title>8.1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 22FFL Hybrid Processor System in 12×12mm2, 1mm Package-on-Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9062957&Exemplar=1&LAN=DE A1 Gomes, Wilfred A1 Khushu, Sanjeev A1 Ingerly, Doug B. A1 Stover, Patrick N. A1 Chowdhury, Nasirul I. A1 O'Mahony, Frank A1 Balankutty, Ajay A1 Dolev, Noam A1 Dixon, Martin G. A1 Jiang, Lei A1 Prekke, Surya A1 Patra, Biswajit A1 Rott, Pavel V. A1 Kumar, Rajesh YR 2020 SN 2376-8606 K1 Three-dimensional displays K1 Through-silicon vias K1 Stacking K1 Capacitance K1 Substrates K1 Random access memory SP 144 OP 146 LK http://dx.doi.org/https://doi.org/10.1109/ISSCC19947.2020.9062957 DO https://doi.org/10.1109/ISSCC19947.2020.9062957 SF ELIB - SuUB Bremen
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