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A Bunch of Wires (BoW) Interface for Inter-Chiplet Communic..:

, In: 2019 IEEE Symposium on High-Performance Interconnects (HOTI),
Farjadrad, Ramin ; Vinnakota, Bapiraju - p. 27-273 , 2019
Link: https://doi.org/10.1109/HOTI.2019.00020