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1 Ergebnisse
1
Ultra Thin Force and Acceleration Sensor Embedded in Flexib..:
, In:
2019 12th International Conference on Developments in eSystems Engineering (DeSE)
,
Mackowiak, Piotr
;
Erbacher, Kolja
;
Zoschke, Kai
... - p. 902-905 , 2019
Link:
https://doi.org/10.1109/DeSE.2019.00167
RT T1 <cTitle>2019 12th International Conference on Developments in eSystems Engineering (DeSE)</cTitle>: T1 <Title>Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9073092&Exemplar=1&LAN=DE A1 Mackowiak, Piotr A1 Erbacher, Kolja A1 Zoschke, Kai A1 Al-Magazachi, Samer A1 Bauscher, Manuel A1 Schiffer, Michael A1 Lang, Klaus-Dieter A1 Ngo, Ha-Duong YR 2019 SN 2161-1351 K1 Acceleration K1 Flexible printed circuits K1 Glass K1 Fabrication K1 Force sensors K1 Polymers K1 Substrates K1 Flexible Substrates K1 Thin Chip Embedding K1 Muil-Layer RDL K1 Laser Structuring K1 Acceleration Sensor K1 Force Sensor K1 Piezoresistiv Sensor K1 Laser Release SP 902 OP 905 LK http://dx.doi.org/https://doi.org/10.1109/DeSE.2019.00167 DO https://doi.org/10.1109/DeSE.2019.00167 SF ELIB - SuUB Bremen
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