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Improvement of Power and Signal Integrity through Layer Ass..:

, In: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Weng, Pei-Yang ; Cheng, Chi-Hsuan ; Wu, Tzong-Lin... - p. 1-3 , 2019
Link: https://doi.org/10.1109/EPEPS47316.2019.193236