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Analysis of residual stress after reflow soldering of QFN p..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Zhao, Sheng-jun ; Huang, Chun-yue ; Tang, Xiang-qiong. - p. 1-3 , 2019
Link: https://doi.org/10.1109/ICEPT47577.2019.245833