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1 Ergebnisse
1
Mechanical properties of a novel multi-scale silver paste f..:
, In:
2019 20th International Conference on Electronic Packaging Technology(ICEPT)
,
Sun, Yongqian
;
Lu, Xiuzhen
;
Zhang, Qiaoran
... - p. 1-4 , 2019
Link:
https://doi.org/10.1109/ICEPT47577.2019.245310
RT T1
2019 20th International Conference on Electronic Packaging Technology(ICEPT)
: T1
Mechanical properties of a novel multi-scale silver paste for electronics interconnect application
UL https://suche.suub.uni-bremen.de/peid=ieee-9081004&Exemplar=1&LAN=DE A1 Sun, Yongqian A1 Lu, Xiuzhen A1 Zhang, Qiaoran A1 Zhang, Xiaoxin A1 Liu, Johan A1 Ye, Lilei YR 2019 K1 silver paste K1 SCA particles K1 shear strength SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT47577.2019.245310 DO https://doi.org/10.1109/ICEPT47577.2019.245310 SF ELIB - SuUB Bremen
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