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1 Ergebnisse
1
Failure Case Analysis and Failure Prevention Method of Phot..:
, In:
2019 20th International Conference on Electronic Packaging Technology(ICEPT)
,
Zhu, Binruo
;
Liu, Liyuan
;
Zhang, Yin
... - p. 1-4 , 2019
Link:
https://doi.org/10.1109/ICEPT47577.2019.245194
RT T1
2019 20th International Conference on Electronic Packaging Technology(ICEPT)
: T1
Failure Case Analysis and Failure Prevention Method of PhotoMOS Relay Bonding Defect
UL https://suche.suub.uni-bremen.de/peid=ieee-9081071&Exemplar=1&LAN=DE A1 Zhu, Binruo A1 Liu, Liyuan A1 Zhang, Yin A1 Chen, Jintao A1 Wang, Xin'gang A1 Zhao, Fang YR 2019 K1 PhotoMOS relay K1 wire bonding defect K1 destructive analysis K1 preventive method SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT47577.2019.245194 DO https://doi.org/10.1109/ICEPT47577.2019.245194 SF ELIB - SuUB Bremen
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