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Study on Thermal Conductivity of Micro-arc Alumina Substrat..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Jiu, Lei ; Pan, Mingqiang ; Sheng, Jun - p. 1-4 , 2019
Link: https://doi.org/10.1109/ICEPT47577.2019.245198