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1 Ergebnisse
1
The influence of phase inhomogeneity on the current density..:
, In:
2019 20th International Conference on Electronic Packaging Technology(ICEPT)
,
Wen, Quan-Zhang
;
Guo, Lei
;
Qin, Hong-Bo
.. - p. 1-5 , 2019
Link:
https://doi.org/10.1109/ICEPT47577.2019.245309
RT T1
2019 20th International Conference on Electronic Packaging Technology(ICEPT)
: T1
The influence of phase inhomogeneity on the current density and temperature gradient in Cu/Sn58Bi/Cu solder joint
UL https://suche.suub.uni-bremen.de/peid=ieee-9081178&Exemplar=1&LAN=DE A1 Wen, Quan-Zhang A1 Guo, Lei A1 Qin, Hong-Bo A1 Li, Wang-Yun A1 Yang, Dao-Guo YR 2019 K1 phase inhomogeneity K1 electromigration K1 thermomigration K1 Sn-Bi solder K1 finite element analysis SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT47577.2019.245309 DO https://doi.org/10.1109/ICEPT47577.2019.245309 SF ELIB - SuUB Bremen
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