I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

How to pressureless sinter-bond power chips with bare coppe..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Chen, Yue ; Mei, Yunhui. ; Feng, Zhihong... - p. 1-4 , 2019
Link: https://doi.org/10.1109/ICEPT47577.2019.245267