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Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Li, Wang-Yun ; Peng, Guan-Qiang ; Cheng, Tian-Xiang... - p. 1-4 , 2019
Link: https://doi.org/10.1109/ICEPT47577.2019.245195