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1 Ergebnisse
1
Crosstalk-aware TSV-buffer Insertion in 3D IC:
, In:
2019 32nd IEEE International System-on-Chip Conference (SOCC)
,
Chen, Yen-Hao
;
Huang, Po-Chen
;
Chen, Fu-Wei
.. - p. 400-405 , 2019
Link:
https://doi.org/10.1109/SOCC46988.2019.1570539111
RT T1 <cTitle>2019 32nd IEEE International System-on-Chip Conference (SOCC)</cTitle>: T1 <Title>Crosstalk-aware TSV-buffer Insertion in 3D IC</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9087992&Exemplar=1&LAN=DE A1 Chen, Yen-Hao A1 Huang, Po-Chen A1 Chen, Fu-Wei A1 Wu, Allen C.-H. A1 Hwang, TingTing YR 2019 SN 2164-1706 SP 400 OP 405 LK http://dx.doi.org/https://doi.org/10.1109/SOCC46988.2019.1570539111 DO https://doi.org/10.1109/SOCC46988.2019.1570539111 SF ELIB - SuUB Bremen
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