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Effect of Molding Compound Material and Roughness Leadframe..:
, In:
2020 Joint International Conference on Digital Arts, Media and Technology with ECTI Northern Section Conference on Electrical, Electronics, Computer and Telecommunications Engineering (ECTI DAMT & NCON)
,
Sukantharat, Anan
;
Ugsornrat, Kessararat
;
Sumithpibul, Chalermsak
- p. 173-176 , 2020
Link:
https://doi.org/10.1109/ECTIDAMTNCON48261.2020.9090724
RT T1 <cTitle>2020 Joint International Conference on Digital Arts, Media and Technology with ECTI Northern Section Conference on Electrical, Electronics, Computer and Telecommunications Engineering (ECTI DAMT & NCON)</cTitle>: T1 <Title>Effect of Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9090724&Exemplar=1&LAN=DE A1 Sukantharat, Anan A1 Ugsornrat, Kessararat A1 Sumithpibul, Chalermsak YR 2020 K1 Delamination K1 Compounds K1 Lead K1 Reliability K1 Conferences K1 Automotive engineering K1 Electronic packaging thermal management K1 Integrated circuit package K1 automotive device K1 quad flat non lead (QFN) K1 Molding compound material K1 leadframe SP 173 OP 176 LK http://dx.doi.org/https://doi.org/10.1109/ECTIDAMTNCON48261.2020.9090724 DO https://doi.org/10.1109/ECTIDAMTNCON48261.2020.9090724 SF ELIB - SuUB Bremen
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