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The Study on Simulation of Thermal-Mechanical Characteristi..:
, In:
2020 IEEE 7th International Conference on Industrial Engineering and Applications (ICIEA)
,
Cha, J. H.
;
Song, K.
;
Park, M. J.
. - p. 202-205 , 2020
Link:
https://doi.org/10.1109/ICIEA49774.2020.9102043
RT T1 <cTitle>2020 IEEE 7th International Conference on Industrial Engineering and Applications (ICIEA)</cTitle>: T1 <Title>The Study on Simulation of Thermal-Mechanical Characteristics according to Structural Factors of EMC Filling via in the Multi-layered FOWLP</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9102043&Exemplar=1&LAN=DE A1 Cha, J. H. A1 Song, K. A1 Park, M. J. A1 Jang, D.Y. YR 2020 K1 Stress K1 Metals K1 Thermal analysis K1 Finite element analysis K1 Thermal stresses K1 Electromagnetic compatibility K1 Temperature K1 FOWLP K1 TMV (Through Mold Via) K1 EFV (EMC Filling Via) K1 warpage simulation K1 package stacking SP 202 OP 205 LK http://dx.doi.org/https://doi.org/10.1109/ICIEA49774.2020.9102043 DO https://doi.org/10.1109/ICIEA49774.2020.9102043 SF ELIB - SuUB Bremen
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