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1 Ergebnisse
1
Drop-in test structure chip to visualize residual stress of..:
, In:
2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS)
,
Usami, Naoto
;
Ota, Etsuko
;
Higo, Akio
.. - p. 1-4 , 2020
Link:
https://doi.org/10.1109/ICMTS48187.2020.9107904
RT T1
2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS)
: T1
Drop-in test structure chip to visualize residual stress of Ru/Cu film grown by atomic layer deposition and supercritical fluid deposition
UL https://suche.suub.uni-bremen.de/peid=ieee-9107904&Exemplar=1&LAN=DE A1 Usami, Naoto A1 Ota, Etsuko A1 Higo, Akio A1 Momose, Takeshi A1 Mita, Yoshio YR 2020 SN 2158-1029 SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICMTS48187.2020.9107904 DO https://doi.org/10.1109/ICMTS48187.2020.9107904 SF ELIB - SuUB Bremen
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