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Backside Alpha-Irradiation Test in Flip-Chip Package in EUV..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Uemura, Taiki ; Chung, Byungjin ; Jo, Jeongmin... - p. 1-4 , 2020
Link: https://doi.org/10.1109/IRPS45951.2020.9129331