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Analysis and Countermeasure of High Deposition Rate of Boil..:

, In: 2020 3rd International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE),
Zhang, Shanshan ; Wu, Qiaoling ; Heng, Shiquan. - p. 676-678 , 2020
Link: https://doi.org/10.1109/AEMCSE50948.2020.00148