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1
Effects of Solder Voiding on the Reliability and Thermal Ch..:
, In:
2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
,
Wilcoxon, Ross
;
Hillman, Dave
;
Pearson, Tim
- p. 124-130 , 2020
Link:
https://doi.org/10.23919/SEMI-THERM50369.2020.9142833
RT T1
2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
: T1
Effects of Solder Voiding on the Reliability and Thermal Characteristics of Quad Flatpack No-lead (QFN) Components
UL https://suche.suub.uni-bremen.de/peid=ieee-9142833&Exemplar=1&LAN=DE A1 Wilcoxon, Ross A1 Hillman, Dave A1 Pearson, Tim YR 2020 K1 Thermal resistance K1 Reliability K1 Printed circuits K1 Thermal conductivity K1 Copper K1 Quad flatpack no-lead (QFN) K1 Solder voiding K1 thermal resistance SP 124 OP 130 LK http://dx.doi.org/https://doi.org/10.23919/SEMI-THERM50369.2020.9142833 DO https://doi.org/10.23919/SEMI-THERM50369.2020.9142833 SF ELIB - SuUB Bremen
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