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1 Ergebnisse
1
Analysis of SiC Schottky diodes after thermal vacuum test b..:
, In:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Vellvehi, M.
;
Perpina, X.
;
Avino, O.
... - p. 1-6 , 2020
Link:
https://doi.org/10.1109/EuroSimE48426.2020.9152625
RT T1 <cTitle>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Analysis of SiC Schottky diodes after thermal vacuum test by means of lock-in infrared thermography</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9152625&Exemplar=1&LAN=DE A1 Vellvehi, M. A1 Perpina, X. A1 Avino, O. A1 Ferrer, C. A1 Fuste, N. A1 Sanchez, D. A1 Jorda, X. A1 Godignon, P. A1 Massetti, S. YR 2020 K1 Silicon carbide K1 Schottky diodes K1 Semiconductor device measurement K1 Space vehicles K1 Mercury (planets) K1 Modulation K1 Thermal analysis SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE48426.2020.9152625 DO https://doi.org/10.1109/EuroSimE48426.2020.9152625 SF ELIB - SuUB Bremen
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