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1 Ergebnisse
1
Virtual Prototyping, Design for Reliability, and Qualificat..:
, In:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
,
Gadhiya, Ghanshyam
;
Kuisma, Heikki
;
Cardoso, Andre
... - p. 1-8 , 2020
Link:
https://doi.org/10.1109/EuroSimE48426.2020.9152629
RT T1 <cTitle>2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</cTitle>: T1 <Title>Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9152629&Exemplar=1&LAN=DE A1 Gadhiya, Ghanshyam A1 Kuisma, Heikki A1 Cardoso, Andre A1 Bramer, Birgit A1 Rzepka, Sven A1 Otto, Thomas YR 2020 K1 Strain K1 Finite element analysis K1 Reliability engineering K1 Creep K1 Automotive engineering K1 Load modeling SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/EuroSimE48426.2020.9152629 DO https://doi.org/10.1109/EuroSimE48426.2020.9152629 SF ELIB - SuUB Bremen
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